Leading the future of mobility with smart, sustainable vehicles. Advanced ADAS, high-performance solutions, and an enduring commitment to zero-defect quality.
Unlocking next-generation computing power with innovative 2.5D & flip chip packaging. Delivering performance and efficiency for leading manufacturers.
Reimagining data security with advanced memory solutions. 3D NAND/SSD, innovative stacking, and a complete silver WB portfolio. Trusted by top OEMs worldwide.
Shaping the intelligent edge with ultra-compact, high-performance AI solutions. Expertise in RF design, 5G testing, and high-density packaging capabilities.
Building a greener future with customizable power solutions (SiC/GaN, DrMOS, PoL, IBC, Si PMICs, etc.). From everyday devices to advanced electronics.
